Dielectric isolation in gate-all-around devices

ABSTRACT

A semiconductor device is fabricated with a first layer of a first sacrificial material deposited over a surface of a substrate. A first set of layers of a second sacrificial material and a second set of layers of a channel material are deposited over the first layer. A liner is deposited in a first recess, which exposes a first connection end of a layer in the second set, where the first recess reaches into the substrate for at least a fraction of a total depth of the substrate. An insulator material is filled in the first recess and etched up to a stop depth, stopping the etching at a height above the surface of the substrate. The liner is removed from at least the first connection end of the layer in the second set. An electrical connection is formed with a source/drain structure using the first connection end.

TECHNICAL FIELD

The present invention relates generally to a semiconductor device, afabrication method, and fabrication system for reducing the substratecurrent in gate-all-around (GAA) semiconductor devices. Moreparticularly, the present invention relates to a device, method, andsystem for dielectric isolation in GAA devices.

BACKGROUND

An integrated circuit (IC) is an electronic circuit formed using asemiconductor material, such as Silicon, as a substrate and by addingimpurities to form solid-state semiconductor electronic devices (device,devices), such as transistors, diodes, capacitors, and resistors. Anyreference to a “device” herein refers to a solid-state semiconductorelectronic device unless expressly distinguished where used.

The software tools used for designing ICs produce, manipulate, orotherwise work with the circuit layout and circuit components on verysmall scales. Some of the components that such a tool may manipulate mayonly measure tens of nanometer across when formed in Silicon. Thedesigns produced and manipulated using these software tools are complex,often including hundreds of thousands of such components interconnectedto form an intended electronic circuitry.

A layout includes shapes that the designer selects and positions toachieve a design objective. The objective is to have the shape—thetarget shape—appear on the wafer as designed. However, the shapes maynot appear exactly as designed when manufactured on the wafer throughphotolithography. For example, a rectangular shape with sharp cornersmay appear as a rectangular shape with rounded corners on the wafer.

Once a design layout, also referred to simply as a layout, has beenfinalized for an IC, the design is converted into a set of masks orreticles. A set of masks or reticles is one or more masks or reticles.During manufacture, a semiconductor wafer is exposed to light orradiation through a mask to form microscopic components of the IC. Thisprocess is known as photolithography.

A manufacturing mask is a mask usable for successfully manufacturing orprinting the contents of the mask onto wafer. During thephotolithographic printing process, radiation is focused through themask and at certain desired intensity of the radiation. This intensityof the radiation is commonly referred to as “dose”. The focus and thedosing of the radiation has to be precisely controlled to achieve thedesired shape and electrical characteristics on the wafer.

A device generally uses several layers of different materials toimplement the device properties and function. A layer of material can beconductive, semi-conductive, insulating, resistive, capacitive, or haveany number of other properties. Different layers of materials have to beformed using different methods, given the nature of the material, theshape, size or placement of the material, other materials adjacent tothe material, and many other considerations.

The software tools used for designing ICs produce, manipulate, orotherwise work with the circuit layout and circuit components on verysmall scales. Some of the components that such a tool may manipulate mayonly measure a few nanometers across when formed in Silicon. The designsproduced and manipulated using these software tools are complex, oftenincluding hundreds of thousands of such components interconnected toform an intended electronic circuitry.

A Field Effect Transistor (FET) is a semiconductor device that controlsthe electrical conductivity between a source of electric current(source, “S”) and a destination of the electrical current (drain, “D”).The FET uses a semiconductor structure called a “gate” to create anelectric field, which controls the shape and consequently the electricalconductivity of a channel between the source and the drain. The channelis a charge carrier pathway constructed using a semiconductor material.

Many semiconductor devices are planar, i.e., where the semiconductorstructures are fabricated on one plane. A non-planar device is athree-dimensional (3D) device where some of the structures are formedabove or below a given plane of fabrication. A fin-Field EffectTransistor (finFET) is a non-planar device in which a source and a drainare connected using a fin-shaped conducting channel (fin).

In a FET, a gate controls the current flow between a source and adrain—i.e., between two S/Ds—through the fin. The direction of a channelrunning from one S/D to the other S/D is referred to herein as a channeldirection. For the clarity of the description and without implying anylimitation thereto, and using the X, Y, Z axes of the coordinate system,the substrate is imagined to be running in an X-Z horizontal plane withthe depth of the substrate being in the Y direction, and the fin runs ina vertical Y-Z plane with the width of the fin being in the X direction.

A GAA device includes one or more channels through such that the gatesurrounds channel completely in all directions except leaving open theends of the channel for connections to the source and drain. As anexample, if imagined as a pipe, the open ends of the pipe connect to thesource and the drain and the gate covers the external surface of thepipe. The gate may cover the surface along the entire length of the pipe(channel) or only a portion of the length of the pipe (channel).

When a GAA device includes multiple channels, each channel can beimagined as a pipe where the set of pipes all run in the same directionfrom the same source to the same drain. In a GAA device with multiplechannels—as used in a non-limiting way to depict and describe variousembodiments herein—each channel (pipe) is separately and completelysurrounded by the gate material along all or a part of the channel'slength between the source and the drain.

SUMMARY

The illustrative embodiments provide a semiconductor device, and amethod and system of fabrication therefor. A semiconductor device of anembodiment includes a first layer comprising a first sacrificialmaterial, wherein the first layer is deposited, over a surface of asubstrate. The embodiment further includes a first set of layers of asecond sacrificial material and a second set of layers of a channelmaterial deposited over the first layer. The embodiment further includesa liner deposited in a first recess, wherein the first recess exposes afirst connection end of a layer in the second set, wherein the firstrecess reaches into the substrate for at least a fraction of a totaldepth of the substrate. The embodiment further includes an insulatormaterial filling the first recess, wherein etching is performed on theinsulator material up to a stop depth, wherein the stop depth stops theetching at a height above the surface of the substrate, wherein theliner is removed from at least the first connection end of the layer inthe second set. The embodiment further includes an electrical connectionformed with a source/drain structure using the first connection end ofthe layer in the second set, wherein a remaining portion of theinsulator below the height and a remaining portion of the liner in thefirst recess impedes a current to flow from the source/drain structureto the substrate.

An embodiment includes a fabrication method for fabricating thesemiconductor device.

An embodiment includes a fabrication system for fabricating thesemiconductor device.

BRIEF DESCRIPTION OF THE DRAWINGS

The novel features believed characteristic of the invention are setforth in the appended claims. The invention itself, however, as well asa preferred mode of use, further objectives and advantages thereof, willbest be understood by reference to the following detailed description ofthe illustrative embodiments when read in conjunction with theaccompanying drawings, wherein:

FIG. 1 depicts a block diagram of a network of data processing systemsin which illustrative embodiments may be implemented;

FIG. 2 depicts a block diagram of a data processing system in whichillustrative embodiments may be implemented;

FIG. 3 depicts a prior-art GAA device and an experimental result ofsubstrate current reduction via substrate bias, which can be improvedwith a structural improvement to provide substrate current minimizationsimilar to but without using the substrate bias in accordance with anillustrative embodiment;

FIG. 4 depicts a block diagram of a comparative improvement provided byone type of structural improvement for dielectric isolation in GAAdevices in accordance with an illustrative embodiment;

FIG. 5 depicts a step in the fabrication of an improved GAA device inaccordance with an illustrative embodiment;

FIG. 6 depicts another step in the fabrication of an improved GAA devicein accordance with an illustrative embodiment;

FIG. 7 depicts another step in the fabrication of an improved GAA devicein accordance with an illustrative embodiment;

FIG. 8 depicts another step in the fabrication of an improved GAA devicein accordance with an illustrative embodiment;

FIG. 9 depicts another step in the fabrication of an improved GAA devicein accordance with an illustrative embodiment;

FIG. 10 depicts another step in the fabrication of an improved GAAdevice in accordance with an illustrative embodiment;

FIG. 11 depicts another step in the fabrication of an improved GAAdevice in accordance with an illustrative embodiment;

FIG. 12 depicts another step in the fabrication of an improved GAAdevice in accordance with an illustrative embodiment;

FIG. 13 depicts a manner of pinching of structures in accordance with anillustrative embodiment;

FIG. 14 depicts an example manner of insulator deposition and etching inpinched structures in accordance with an illustrative embodiment;

FIG. 15 depicts refilling the recess in the insulator created in pinchedareas in accordance with an illustrative embodiment;

FIG. 16 depicts a block diagram of an example application forfabricating dielectric isolation in GAA devices in accordance with anillustrative embodiment; and

FIG. 17 depicts a flowchart of an example process for dielectricisolation in GAA devices in accordance with an illustrative embodiment.

DETAILED DESCRIPTION

The illustrative embodiments recognize that one of the problems in GAAdevices is an unintended flow of current between the source and thedrain through the dielectric material of the substrate, without passingthrough a channel, and without being subjected to the control of thegate. This undesirable current through the substrate is hereinafterreferred to as “substrate current.” Experiments have shown that whenthis current is inhibited, such as by applying a voltage to thesubstrate in an effort to draw electrons away from the substrate, theminimizing effect on the substrate current shows an improvement in theperformance of the GAA device.

The illustrative embodiments recognize that the substrate current shouldbe reduced or removed to improve the performance of the GAA devicefabricated on the substrate. The illustrative embodiments furtherrecognize that applying a voltage to the substrate is a less desirableway of reducing the substrate current than creating the GAA structuresin a way that reduce the substrate current. Thus, the illustrativeembodiments recognize that the structures of the GAA device should beconstructed in such a manner that the substrate is electrically isolatedto a substantial degree from the source, the drain, the gate, and thechannels.

The illustrative embodiments used to describe the invention generallyaddress and solve the above-described problems and other problemsrelated to dielectric isolation in GAA devices. The illustrativeembodiments provide a fabrication method for dielectric isolation in GAAdevices.

An embodiment can be implemented as a software application. Theapplication implementing an embodiment can be configured as amodification of an existing semiconductor fabrication system—such as aphotolithography system, as a separate application that operates inconjunction with an existing semiconductor fabrication system, astandalone application, or some combination thereof. For example, theapplication causes the semiconductor fabrication system to perform thesteps described herein, to fabricate a GAA device in which the substratecurrent is significantly reduced, as described herein.

For the clarity of the description, and without implying any limitationthereto, the illustrative embodiments are described using amulti-channel GAA finFET where a single fin couples the S/D on one sideof the fin to the S/D on the opposite side of the fin. An embodiment canbe implemented with a different number of channels per fin, differentnumber of fins, different directions of the fin (e.g., as in a verticalfin finFET), or both, within the scope of the illustrative embodiments.An embodiment can be implemented with other types of GAA channeldevices, and such adaptations are contemplated herein.

Furthermore, a simplified diagram of the example GAA device is used inthe figures and the illustrative embodiments. In an actual fabricationof a GAA device, additional structures that are not shown or describedherein, or structures different from those shown and described herein,may be present without departing the scope of the illustrativeembodiments. Similarly, within the scope of the illustrativeembodiments, a shown or described structure in the example GAA devicemay be fabricated differently to yield a similar operation or result asdescribed herein.

Differently shaded portions in the two-dimensional drawing of theexample structures, layers, and formations are intended to representdifferent structures, layers, and formations in the example fabrication,as described herein. The different structures, layers, and formationsmay be fabricated using suitable materials that are known to those ofordinary skill in the art.

A specific shape, location, position, or dimension of a shape depictedherein is not intended to be limiting on the illustrative embodimentsunless such a characteristic is expressly described as a feature of anembodiment. The shape, location, position, dimension, or somecombination thereof, are chosen only for the clarity of the drawings andthe description and may have been exaggerated, minimized, or otherwisechanged from actual shape, location, position, or dimension that mightbe used in actual photolithography to achieve an objective according tothe illustrative embodiments.

Furthermore, the illustrative embodiments are described with respect toa specific actual or hypothetical semiconductor device only as anexample. The steps described by the various illustrative embodiments canbe adapted for fabricating a variety of planar and non-planar GAAdevices in a similar manner, and such adaptations are contemplatedwithin the scope of the illustrative embodiments.

An embodiment when implemented in an application causes a fabricationprocess to perform certain steps as described herein. The steps of thefabrication process are depicted in the several figures. Not all stepsmay be necessary in a particular fabrication process. Some fabricationprocesses may implement the steps in different order, combine certainsteps, remove or replace certain steps, or perform some combination ofthese and other manipulations of steps, without departing the scope ofthe illustrative embodiments.

A method of an embodiment described herein, when implemented to executeon a device or data processing system, comprises substantial advancementof the functionality of that device or data processing system infabricating dielectric isolation in GAA devices. A manner of reducingthe substrate current by constructing a structure in the GAA device isunavailable in the presently available methods. Thus, a substantialadvancement of such devices or data processing systems by executing amethod of an embodiment is in an improved fabrication of GAA deviceswhere the device structurally inhibits or reduces the substrate currentinstead of an electrical voltage or bias being applied to the substrate.

The illustrative embodiments are described with respect to certain typesof devices, electrical properties, structures, formations, layersorientations, directions, steps, operations, planes, structures,materials, dimensions, numerosity, data processing systems,environments, components, and applications only as examples. Anyspecific manifestations of these and other similar artifacts are notintended to be limiting to the invention. Any suitable manifestation ofthese and other similar artifacts can be selected within the scope ofthe illustrative embodiments.

Furthermore, the illustrative embodiments may be implemented withrespect to any type of data, data source, or access to a data sourceover a data network. Any type of data storage device may provide thedata to an embodiment of the invention, either locally at a dataprocessing system or over a data network, within the scope of theinvention. Where an embodiment is described using a mobile device, anytype of data storage device suitable for use with the mobile device mayprovide the data to such embodiment, either locally at the mobile deviceor over a data network, within the scope of the illustrativeembodiments.

The illustrative embodiments are described using specific code, designs,architectures, protocols, layouts, schematics, and tools only asexamples and are not limiting to the illustrative embodiments.Furthermore, the illustrative embodiments are described in someinstances using particular software, tools, and data processingenvironments only as an example for the clarity of the description. Theillustrative embodiments may be used in conjunction with othercomparable or similarly purposed structures, systems, applications, orarchitectures. For example, other comparable mobile devices, structures,systems, applications, or architectures therefor, may be used inconjunction with such embodiment of the invention within the scope ofthe invention. An illustrative embodiment may be implemented inhardware, software, or a combination thereof.

The examples in this disclosure are used only for the clarity of thedescription and are not limiting to the illustrative embodiments.Additional data, operations, actions, tasks, activities, andmanipulations will be conceivable from this disclosure and the same arecontemplated within the scope of the illustrative embodiments.

Any advantages listed herein are only examples and are not intended tobe limiting to the illustrative embodiments. Additional or differentadvantages may be realized by specific illustrative embodiments.Furthermore, a particular illustrative embodiment may have some, all, ornone of the advantages listed above.

With reference to the figures and in particular with reference to FIGS.1 and 2, these figures are example diagrams of data processingenvironments in which illustrative embodiments may be implemented. FIGS.1 and 2 are only examples and are not intended to assert or imply anylimitation with regard to the environments in which differentembodiments may be implemented. A particular implementation may makemany modifications to the depicted environments based on the followingdescription.

FIG. 1 depicts a block diagram of a network of data processing systemsin which illustrative embodiments may be implemented. Data processingenvironment 100 is a network of computers in which the illustrativeembodiments may be implemented. Data processing environment 100 includesnetwork 102. Network 102 is the medium used to provide communicationslinks between various devices and computers connected together withindata processing environment 100. Network 102 may include connections,such as wire, wireless communication links, or fiber optic cables.

Clients or servers are only example roles of certain data processingsystems connected to network 102 and are not intended to exclude otherconfigurations or roles for these data processing systems. Server 104and server 106 couple to network 102 along with storage unit 108.Software applications may execute on any computer in data processingenvironment 100. Clients 110, 112, and 114 are also coupled to network102. A data processing system, such as server 104 or 106, or client 110,112, or 114 may contain data and may have software applications orsoftware tools executing thereon.

Only as an example, and without implying any limitation to sucharchitecture, FIG. 1 depicts certain components that are usable in anexample implementation of an embodiment. For example, servers 104 and106, and clients 110, 112, 114, are depicted as servers and clients onlyas example and not to imply a limitation to a client-serverarchitecture. As another example, an embodiment can be distributedacross several data processing systems and a data network as shown,whereas another embodiment can be implemented on a single dataprocessing system within the scope of the illustrative embodiments. Dataprocessing systems 104, 106, 110, 112, and 114 also represent examplenodes in a cluster, partitions, and other configurations suitable forimplementing an embodiment.

Device 132 is an example of a data processing device or a portabledevice usable for computing or communications purposes described herein.For example, device 132 can take the form of a smartphone, a tabletcomputer, a laptop computer, client 110 in a stationary or a portableform, a wearable computing device, or any other suitable device. Anysoftware application described as executing in another data processingsystem in FIG. 1 can be configured to execute in device 132 in a similarmanner. Any data or information stored or produced in another dataprocessing system in FIG. 1 can be configured to be stored or producedin device 132 in a similar manner.

Application 105 implements an embodiment described herein. Fabricationsystem 107 is any suitable system for fabricating a semiconductordevice. Application 105 provides instructions to system 107 forfabricating a device, component, or structure, in a manner describedherein.

Servers 104 and 106, storage unit 108, and clients 110, 112, and 114 maycouple to network 102 using wired connections, wireless communicationprotocols, or other suitable data connectivity. Clients 110, 112, and114 may be, for example, personal computers or network computers.

In the depicted example, server 104 may provide data, such as bootfiles, operating system images, and applications to clients 110, 112,and 114. Clients 110, 112, and 114 may be clients to server 104 in thisexample. Clients 110, 112, 114, or some combination thereof, may includetheir own data, boot files, operating system images, and applications.Data processing environment 100 may include additional servers, clients,and other devices that are not shown.

In the depicted example, data processing environment 100 may be theInternet. Network 102 may represent a collection of networks andgateways that use the Transmission Control Protocol/Internet Protocol(TCP/IP) and other protocols to communicate with one another. At theheart of the Internet is a backbone of data communication links betweenmajor nodes or host computers, including thousands of commercial,governmental, educational, and other computer systems that route dataand messages. Of course, data processing environment 100 also may beimplemented as a number of different types of networks, such as forexample, an intranet, a local area network (LAN), or a wide area network(WAN). FIG. 1 is intended as an example, and not as an architecturallimitation for the different illustrative embodiments.

Among other uses, data processing environment 100 may be used forimplementing a client-server environment in which the illustrativeembodiments may be implemented. A client-server environment enablessoftware applications and data to be distributed across a network suchthat an application functions by using the interactivity between aclient data processing system and a server data processing system. Dataprocessing environment 100 may also employ a service orientedarchitecture where interoperable software components distributed acrossa network may be packaged together as coherent business applications.

With reference to FIG. 2, this figure depicts a block diagram of a dataprocessing system in which illustrative embodiments may be implemented.Data processing system 200 is an example of a computer, such as servers104 and 106, or clients 110, 112, and 114 in FIG. 1, or another type ofdevice in which computer usable program code or instructionsimplementing the processes may be located for the illustrativeembodiments.

Data processing system 200 is also representative of a data processingsystem or a configuration therein, such as data processing system 132 inFIG. 1 in which computer usable program code or instructionsimplementing the processes of the illustrative embodiments may belocated. Data processing system 200 is described as a computer only asan example, without being limited thereto. Implementations in the formof other data processing devices, such as mobile device 132 in FIG. 1,may modify data processing system 200, such as by adding a touchinterface, and even eliminate certain depicted components from dataprocessing system 200 without departing from the general description ofthe operations and functions of data processing system 200 describedherein.

In the depicted example, data processing system 200 employs a hubarchitecture including North Bridge and memory controller hub (NB/MCH)202 and South Bridge and input/output (I/O) controller hub (SB/ICH) 204.Processing unit 206, main memory 208, and graphics processor 210 arecoupled to North Bridge and memory controller hub (NB/MCH) 202.Processing unit 206 may contain one or more processors and may beimplemented using one or more heterogeneous processor systems.Processing unit 206 may be a multi-core processor. Graphics processor210 may be coupled to NB/MCH 202 through an accelerated graphics port(AGP) in certain implementations.

In the depicted example, local area network (LAN) adapter 212 is coupledto South Bridge and I/O controller hub (SB/ICH) 204. Audio adapter 216,keyboard and mouse adapter 220, modem 222, read only memory (ROM) 224,universal serial bus (USB) and other ports 232, and PCI/PCIe devices 234are coupled to South Bridge and I/O controller hub 204 through bus 238.Hard disk drive (HDD) or solid-state drive (SSD) 226 and CD-ROM 230 arecoupled to South Bridge and I/O controller hub 204 through bus 240.PCI/PCIe devices 234 may include, for example, Ethernet adapters, add-incards, and PC cards for notebook computers. PCI uses a card buscontroller, while PCIe does not. ROM 224 may be, for example, a flashbinary input/output system (BIOS). Hard disk drive 226 and CD-ROM 230may use, for example, an integrated drive electronics (IDE), serialadvanced technology attachment (SATA) interface, or variants such asexternal-SATA (eSATA) and micro-SATA (mSATA). A super I/O (SIO) device236 may be coupled to South Bridge and I/O controller hub (SB/ICH) 204through bus 238.

Memories, such as main memory 208, ROM 224, or flash memory (not shown),are some examples of computer usable storage devices. Hard disk drive orsolid state drive 226, CD-ROM 230, and other similarly usable devicesare some examples of computer usable storage devices including acomputer usable storage medium.

An operating system runs on processing unit 206. The operating systemcoordinates and provides control of various components within dataprocessing system 200 in FIG. 2. The operating system may be acommercially available operating system such as AIX® (AIX is a trademarkof International Business Machines Corporation in the United States andother countries), Microsoft® Windows® (Microsoft and Windows aretrademarks of Microsoft Corporation in the United States and othercountries), Linux® (Linux is a trademark of Linus Torvalds in the UnitedStates and other countries), iOS™ (iOS is a trademark of Cisco Systems,Inc. licensed to Apple Inc. in the United States and in othercountries), or Android™ (Android is a trademark of Google Inc., in theUnited States and in other countries). An object oriented programmingsystem, such as the Java™ programming system, may run in conjunctionwith the operating system and provide calls to the operating system fromJava™ programs or applications executing on data processing system 200(Java and all Java-based trademarks and logos are trademarks orregistered trademarks of Oracle Corporation and/or its affiliates).

Instructions for the operating system, the object-oriented programmingsystem, and applications or programs, such as application 105 in FIG. 1,are located on storage devices, such as in the form of code 226A on harddisk drive 226, and may be loaded into at least one of one or morememories, such as main memory 208, for execution by processing unit 206.The processes of the illustrative embodiments may be performed byprocessing unit 206 using computer implemented instructions, which maybe located in a memory, such as, for example, main memory 208, read onlymemory 224, or in one or more peripheral devices.

Furthermore, in one case, code 226A may be downloaded over network 201Afrom remote system 201B, where similar code 201C is stored on a storagedevice 201D. in another case, code 226A may be downloaded over network201A to remote system 201B, where downloaded code 201C is stored on astorage device 201D.

The hardware in FIGS. 1-2 may vary depending on the implementation.Other internal hardware or peripheral devices, such as flash memory,equivalent non-volatile memory, or optical disk drives and the like, maybe used in addition to or in place of the hardware depicted in FIGS.1-2. In addition, the processes of the illustrative embodiments may beapplied to a multiprocessor data processing system.

In some illustrative examples, data processing system 200 may be apersonal digital assistant (PDA), which is generally configured withflash memory to provide non-volatile memory for storing operating systemfiles and/or user-generated data. A bus system may comprise one or morebuses, such as a system bus, an I/O bus, and a PCI bus. Of course, thebus system may be implemented using any type of communications fabric orarchitecture that provides for a transfer of data between differentcomputer-components or data processing devices attached to the fabric orarchitecture.

A communications unit may include one or more communications-capabledevices used to transmit and receive data, such as a modem or a networkadapter. A memory may be, for example, main memory 208 or a cache, suchas the cache found in North Bridge and memory controller hub 202. Aprocessing unit may include one or more processors or CPUs.

The depicted examples in FIGS. 1-2 and above-described examples are notmeant to imply architectural limitations. For example, data processingsystem 200 also may be a tablet computer, laptop computer, or telephonedevice in addition to taking the form of a mobile or wearable device.

Where a computer or data processing system is described as a virtualmachine, a virtual device, or a virtual component, the virtual machine,virtual device, or the virtual component operates in the manner of dataprocessing system 200 using virtualized manifestation of some or allcomponents depicted in data processing system 200. For example, in avirtual machine, virtual device, or virtual component, processing unit206 is manifested as a virtualized instance of all or some number ofhardware processing units 206 available in a host data processingsystem, main memory 208 is manifested as a virtualized instance of allor some portion of main memory 208 that may be available in the hostdata processing system, and disk 226 is manifested as a virtualizedinstance of all or some portion of disk 226 that may be available in thehost data processing system. The host data processing system in suchcases is represented by data processing system 200.

With reference to FIG. 3, this figure depicts a prior-art GAA device andan experimental result of substrate current reduction via substratebias, which can be improved with a structural improvement to providesubstrate current minimization similar to but without using thesubstrate bias in accordance with an illustrative embodiment. Device 302is an example GAA device which uses S/D epitaxy (epi) 304 and 306.Either of epi 304 or 306 can operate as the source and the remaining ofepi 304 and 306 operates as the drain. For example, contact 308 may be ametallic conducting material forming electrical connection to source (ordrain) epi 304, and contact 310 may be a similar metallic conductingmaterial forming electrical connection to drain (or source) epi 306.

Gate 312 and channels 314, 316, and 318 are fabricated over substrate320. As can be seen in a two-dimensional cross-section on the X-Y plane,gate 312 surrounds channels 314, 316, and 318, thus formingGate-All-Around device 302. As can also be seen, substrate 320 providesan unintended current path for substrate current 322 from epi 304 to epi306 through substrate 320. Isolating substrate 320 from at least gate320, and preferably from epi 304 epi 306 and gate 312, is desirable forthe reasons described herein. The isolation of substrate 320 should bestructurally accomplished such that the structure either (i)substantially increases the length of the path of substrate current 322thereby increasing a resistance of the path and decreasing substratecurrent 322, or (ii) substantially block the path with a structure whosematerial presents a higher than a threshold resistance to substratecurrent 322, thereby reducing substrate current 322.

View 332 is a microscopic picture of an example actual GAA device wheresubstrate 320 allows substrate current 322 to undesirably flow asdescribed herein. View 332 is a cross-section across the Y-Z plane ofthe device shown in block schematic view 302. Channels 314, 316, and 318are clearly visible surrounded by the material of gate 312. Gate 312 andchannels 314-318 are formed over substrate 320, which allows theundesirable path for substrate current 322 as shown in view 332.

Graph 352 depicts the results of an experiment performed with device ofview 332. When voltage Vsub is applied to substrate 320, the currentflow between epi 304 and epi 306, through channels 314-318, switchesfrom value A to value B. A lower (negative) value Vsub=0 plot shows aless distinct switch or change in the current value, as compared to theplots for Vsub=−1, Vsub=−2, Vsub=−3, and Vsub=−4 which show morepronounced switches from A to B. Thus, the higher the negative voltageof substrate 320 (to draw electrons away from substrate 320), the betterthe performance of the GAA device in view 332. This effect of Vsubshould be achievable through structural modification of the device inview 332, as presented by one or more of the embodiments describedherein.

With reference to FIG. 4, this figure depicts a block diagram of acomparative improvement provided by one type of structural improvementfor dielectric isolation in GAA devices in accordance with anillustrative embodiment. Configuration 402 is similar to configuration302 or 332 in FIG. 3. Substrate current 422 is similar in value, impacton performance of device 402, and therefore undesirable in the manner ofsubstrate current 322 in FIG. 3.

Configuration 452 is an improved configuration according to anillustrative embodiment. Configuration 452 adds structure 454 betweenthe gate material and the substrate, e.g., between the bottom-most layerof gate material 312 and substrate 320 in FIG. 3. The material used toform structure 454 is a high-resistance dielectric material, and can beany of numerous materials with such properties as are known to those ofordinary skill in the art. The fabrication and placement of structure454 where shown causes substrate current 456 to go around structure 454,thus significantly lengthening the path and weakening substrate current456 to within a defined acceptable substrate current threshold. Theperformance of the device depicted in configuration 452 mimics thepronounced channel current switches, for example, as shown for Vsub=−3in graph 352 of FIG. 3.

With reference to FIG. 5, this figure depicts a step in the fabricationof an improved GAA device in accordance with an illustrative embodiment.The improved GAA device fabricated using the step on stacked structure500 is an example of the non-limiting device depicted in schematic 452in FIG. 4.

Substrate 502 is similar to substrate 320 of FIG. 3. For example, thematerials and methods of constructing substrate 502 can be similar tothe materials and methods of constructing substrate 320 in FIG. 3.

Stacked structure 500 (also referred to herein as a stacked channelstructure) comprises a set of layers. An embodiment deposits orotherwise creates sacrificial layer 504 on a surface of substrate 502where the GAA device will be fabricated. Sacrificial layer 504 isfabricated from a material that is highly etchable, to wit, is capableof being etched away at greater than a threshold rate.

Continuing building in the same direction, over layer 504, theembodiment deposits or otherwise creates alternating layers ofsacrificial material 506 and channel material 508. on a surface ofsubstrate 502 where the GAA device will be fabricated. Sacrificiallayers 506 are fabricated from a material that is less etchable thansacrificial layer 504, to wit, is capable of being etched away at orbelow than the threshold rate. As a non-limiting example, SiGe 50%(Silicon-Germanium with fifty percent Germanium) may be used toconstruct sacrificial layer 504 and SiGe 35% (Silicon-Germanium withthirty-five percent Germanium) may be used to construct layers 506because it is known that SiGe 50% etches away faster than SiGe 35%.Channel material 508 may be, but is not limited to Silicon (Si).

With reference to FIG. 6, this figure depicts another step in thefabrication of an improved GAA device in accordance with an illustrativeembodiment. The step depicted in this figure modifies stacked structure500 in FIG. 5.

An embodiment cuts a plurality of recesses in stacked structure 500 toform one or more stacked structures 600 as shown. For example, toconstruct two stacked structures 600, recesses 602, 604, and 606 arecut, trenched, or otherwise constructed as shown. Essentially, recesses602-606 form two example fins 608 and 610, and go at least partiallythrough the total depth of substrate 502.

Recesses 602-606 will eventually be used to fabricate S/D epi structuressimilar to epi 304 and 306 in FIG. 3. For example, an epi in recess 602could be the source across fin 608, an epi in recess 602 could be thedrain across fin 608 and a source across fin 610, and an epi in recess608 could be the drain across fin 610. Any number of recesses for asimilar purpose can be created without limitation.

Structures 612 are fabricated over stacked structures 500 in fins 608and 610 using known processes. For example, poly-silicon contact (PC)614, Nitride (SiN) or similar hard-mask 616, and Oxide (SiO2) or similarhard-mask 618 may be fabricated and protected by gate spacer 620 of asuitable spacer material. PC 614 may also be made as a sacrificial dummygate material that is removed later and refilled with the gate contactmetals. Dielectric materials such as SiN, SiBCN, SiOCN, or other siliconnitride or oxide materials are usable as the spacer material.

With reference to FIG. 7, this figure depicts another step in thefabrication of an improved GAA device in accordance with an illustrativeembodiment. The step depicted in this figure further modifies stackedstructure 600 in FIG. 6.

A suitable etching process is applied to stacked structure 600 to erode,dissolve, etch, or otherwise remove sacrificial layer material fromstructure 600. A non-limiting example of the etching process can be hotSC1 process known to those of ordinary skill in the art. The etchingprocess etches sacrificial layer 504 much faster than sacrificial layers506 because of the differences in the etching properties of thematerials used.

The etching process is applied until layer 504 is completely removedfrom between remaining structure 700 and substrate 502. Space 702indicates where layer 504 was located. Indentations 704 show thecomparatively reduced depth to which layers 506 have been etched.Etching in this manner exposes the connecting ends of channel layers 508and optionally some of the lengthwise surface of channel layers 508.

With reference to FIG. 8, this figure depicts another step in thefabrication of an improved GAA device in accordance with an illustrativeembodiment. The step depicted in this figure further modifies stackedstructure 700 in FIG. 7.

A suitable spacer deposition process is applied to stacked structure 700to form structure 800. The deposition process deposits, adds, orotherwise fabricates spacer layer 801 on structure 700. As anon-limiting example, spacer layer 801 may be formed using Nitride.Spacer layer 801 is also referred to herein as an inner spacer.

Spacer layer 801 is deposited in such a manner that at least structure700 and recesses 602, 604, and 606 are covered by a defined thickness ofspacer layer 801. Optionally, spacer layer 801 may extend to cover otherstructures in fins 608 and 610, including but not necessarily theentirety of fins 608 and 610. Accordingly, recess 602 covered by spacerlayer 801 transforms to recess 802, recess 604 covered by spacer layer801 transforms to recess 804, and recess 606 covered by spacer layer 801transforms to recess 806 as shown. Thus, an instance of structure 800includes spacer material 801 covering at least an instance of a recessin substrate 502 and an instance of structure 700. Optionally, aninstance of structure 800 may also include spacer material 801 coveringstructure 612 of a fin. Spacer material 801 may be any of a large numberof dielectric materials that are known and available in semiconductorfabrication, and may be selected according to suitability in aparticular implementation.

With reference to FIG. 9, this figure depicts another step in thefabrication of an improved GAA device in accordance with an illustrativeembodiment. The step depicted in this figure further modifies stackedstructure 700 in FIG. 7.

A suitable deposition or filling process is applied to structure 800 toform structure 900. For example, in one embodiment, the processdeposits, adds, or otherwise fills an insulator, such as oxide (SiO2) orsimilar material 901, on structure 800.

Insulator 901 is filled in such a manner that at least structure 800 iscovered up to a defined thickness, and recesses 802, 804, and 806 arefilled by insulator 901. Optionally, insulator 901 may extend to coverother optionally included portions of structure 800, to form theoptionally included portion of structure 900 as shown.

With reference to FIG. 10, this figure depicts another step in thefabrication of an improved GAA device in accordance with an illustrativeembodiment. The step depicted in this figure further modifies structure900 in FIG. 9.

A suitable etching process is applied to structure 900 to erode,dissolve, etch, or otherwise remove insulator from structure 900. Anon-limiting example for one part of the etching process can be ChemicalMechanical Planarization (CMP) process known to those of ordinary skillin the art, which is configured to stop at the inner spacer layer 801. Anon-limiting example for another part of the etching process can bebuffered hydrofluoric acid (BHF) controlled recess at some point belowthe last channel layer 508 without etching into recesses 802-806.Configured in this manner, the etching process leaves insulator 901filled at least into recesses 802-806 and optionally up to some height Habove the top surface of substrate 502 while remaining below the lowestchannel layer 508.

With reference to FIG. 11, this figure depicts another step in thefabrication of an improved GAA device in accordance with an illustrativeembodiment. The step depicted in this figure further modifies theremaining portions of structure 900 after the etching process of FIG.10.

A suitable etching process dissolves, etches, or otherwise removesspacer layer 801 from portion 1100 such that the connection ends ofchannel layers 508 are exposed and available for electrical connection.Optionally, the etching process also removes spacer layer 801 fromstructures 612 in fins 608 and 610 as shown.

Due to the presence of insulator 901 from height H and below, theetching process does not remove insulator 901 or spacer layer 801 belowheight H. The unremoved portions of spacer layer 801 and the unremovedportions of insulator 901 together form isolating dielectric 1102, whichis represented as dielectric 454 in FIG. 4, in an improved GAA deviceaccording to the illustrative embodiments. This isolating dielectric1102 operates to electrically isolates substrate 502 from the S/D episthat are grown above them such that a substrate current flow from theepis through substrate 502 faces high resistance of isolating dielectric1102 and is minimized below an acceptable threshold value.

With reference to FIG. 12, this figure depicts another step in thefabrication of an improved GAA device in accordance with an illustrativeembodiment. The step depicted in this figure further modifies theexposed ends of channel layers 508 after the formation of isolatingdielectric 1102 in FIG. 11.

An epi growth process grows epis 1202, 1204, and 1206 on each exposedend of channel layers 508 to electrically couple the same ends of eachchannel together. For example, relative to fin 608, epi 1202 is afunctional equivalent of epi 304 in FIG. 3 over which contact 308 can beformed, and epi 1204 is a functional equivalent of epi 306 in FIG. 3over which contact 310 can be formed. Similarly, relative to fin 610,epi 1204 is a functional equivalent of epi 304 in FIG. 3 over whichcontact 308 can be formed, and epi 1206 is a functional equivalent ofepi 306 in FIG. 3 over which contact 310 can be formed.

In some cases, as shown in FIG. 8, parallel structures such as fins 608and 610 covered with spacer layer 800 cannot maintain a constantdistance from one another, e.g., from the top to the bottom of fins 608and 610. Generally, a tapering occurs such that the distance betweenfins 608 and 610 at the top becomes greater than the distance betweenfins 608 and 610 at the bottom. Such tapering is called pinching.Pinching can also be created intentionally by depositing more spacerliner material at the bottom—near the recess in substrate 502—ascompared to an amount of spacer liner material deposited towards thetop—away from the recess in substrate 502.

FIG. 13 depicts a manner of pinching of structures in accordance with anillustrative embodiment. The pinching depicted in this figure can be anunintended unevenness caused by the fabrication process, or can beformed intentionally by depositing different thicknesses of nitride fromthe top to the bottom of fins 608 and 610.

When pinching has occurred, or has been caused to occur, recess 802,804, and 806 may not have available space to be filled by insulator 901.In such cases, insulator 901 may not occupy any space within thesubstrate boundary and may simply deposit over the pinched recesses.

FIG. 14 depicts an example manner of insulator deposition and etching inpinched structures in accordance with an illustrative embodiment. Ascompared to FIG. 9, during conformal insulator deposition, the bottom ofthe valley formed by the pinching is going to be filled by the insulatormaterial, such as oxide, due to the tapered profile. This phenomenon iscalled dielectric pinch-off. as a result, when the etching of FIG. 10occurs, the bottom of the filled valley will be slightly recessed andsome insulator will remain on the nitride layer due to the smallexposure area, while other exposed surfaces of the insulator are cleanedup to the spacer layer as shown.

FIG. 15 depicts refilling the recess in the insulator created in pinchedareas in accordance with an illustrative embodiment. An embodimentdeposits a suitable insulator in the insulator recess formed in FIG. 14.The deposition may use iRAD or high-density plasma (HDP) to deposit theinsulator, such as SiO2 in the insulator valley. Thereafter, theinsulator etching is performed in the manner of FIG. 10. Thereafter, theembodiment progresses as described in FIG. 11 et seq.

With reference to FIG. 16, this figure depicts a block diagram of anexample application for fabricating dielectric isolation in GAA devicesin accordance with an illustrative embodiment. Application 1602 can beimplemented as application 105 in FIG. 1.

Application 1602 is configured to perform a suitable combination andorder of the steps described from FIGS. 5-15, as may be suitable in agiven implementation. For example, component 1604 causes a fabricationsystem to construct the layers as described in FIG. 5, and form therecesses as shown in FIG. 6.

Component 1606 causes the highly etchable sacrificial layer to be etchedfully between the substrate and the layers above as shown in FIG. 7.Component 1608 causes the less etchable sacrificial layers partiallyaround and between the channel layers, as shown in FIG. 7.

Component 1610 causes the spacer layer (protection layer) to bedeposited, as in FIG. 8. Any intentional or unintentional pinch-offoccurs in the operation of component 1610 as well, as described in FIG.13. Component 1610 fills the insulator as described in FIG. 9 and FIG.14 depending on the pinch-off circumstance.

Component 1612 causes an etching of the insulator to occur, stopping theetching at height H and at the spacer (protection) layer, as shown inFIG. 10. Component 1614 causes the channel layer connection ends tobecome exposed through the removal of the protection layer from thatarea, as shown in FIG. 11. Component 1616 causes S/D epis to be grown atthe exposed channel ends in the manner of FIG. 12.

With reference to FIG. 17, this figure depicts a flowchart of an exampleprocess for dielectric isolation in GAA devices in accordance with anillustrative embodiment. Process 1700 can be implemented in application1602 in FIG. 16.

The application deposits a highly etchable layer over a substrate (block1702). The application deposits alternating layers of channel materialand a less etchable material over the highly etchable layer (block1704).

The application creates a source recess and a drain recess through thelayers, channel material and at least partially into the substrateforming a stacked structure (block 1706). The application protects thestacked structure and the substrate trench using a spacer liner (block1708). The application deposits a controllably etchable insulator fillerover the spacer layer (block 1710).

The application etches the filler up to a stop depth above the substrateand up to the spacer liner on the stacked structure (block 1712). Theapplication etches the liner on the stacked structure to expose theconnection ends of the channel layers on the trench sides (block 1714).

The application grows S/D epis in the trenches to electrically connectthe channel ends that are on the same side of the stacked structure(block 1716). The application continues the gate and other fabricationas needed (block 1718). The application ends process 1700 thereafter.

What is claimed is:
 1. A semiconductor device comprising: a first layerdeposited over a surface of a substrate; a second set of layers of achannel material deposited over the first layer; a liner deposited in afirst recess; a first connection end of a layer in the second setexposed from the liner; an insulator material filling the first recessup to a height above the surface of the substrate; and an electricalconnection formed with a source/drain structure using the firstconnection end of the layer in the second set, wherein a remainingportion of the insulator below the height and a remaining portion of theliner in the first recess electrically isolates the source/drainstructure from the substrate and increases impedance in a path of asubstrate current from the source/drain structure to the substrate. 2.The semiconductor device of claim 1, further comprising: an epitaxystructure grown in electrical connection with the first connection endof the layer in the second set, wherein the epitaxy structure operatesas the source/drain structure.
 3. The semiconductor device of claim 1,wherein the height above the substrate is zero.
 4. The semiconductordevice of claim 1, wherein the height above the surface of the substratereaches up to a substrate-facing surface of a bottom-most layer in thesecond set of layers.
 5. The semiconductor device of claim 1, whereinthe first layer and the second set of layers together form a stack oflayers, further comprising: the first recess and a second recess formedby recessing the stack of layers, wherein the second recess exposes asecond connection end of the layer in the second set, the secondconnection end being on an opposite side from the connection end,wherein the first recess and the second recess each reaches into thesubstrate for at least the fraction of the total depth of the substrate.6. The semiconductor device of claim 1, wherein a second layerimmediately adjacent to the first layer comprises the second sacrificialmaterial.
 7. The semiconductor device of claim 1, wherein a second layerimmediately adjacent to the first layer comprises the channel material.8. The semiconductor device of claim 1, wherein the set of layers of thechannel material includes a plurality of layers.
 9. The semiconductordevice of claim 1, wherein the first layer comprises a first sacrificialmaterial, wherein the first sacrificial material is etchable by aprocess at a first rate, wherein the second sacrificial material isetchable by the process at a second rate, and wherein the first rate isgreater than the second rate.
 10. A method comprising: depositing, overa surface of a substrate, a first layer; depositing, over the firstlayer, a second set of layers of a channel material; depositing a linerin a first recess; exposing from the liner a first connection end of alayer in the second set; causing the first recess to be occupied with aninsulator material up to a height above the surface of the substrate;and enabling the first connection end of the layer in the second set toform an electrical connection with a source/drain structure, wherein aremaining portion of the insulator below the height and a remainingportion of the liner in the first recess electrically isolates thesource/drain structure from the substrate and increases impedance in apath of a substrate current from the source/drain structure to thesubstrate.
 11. The method of claim 10, further comprising: growing anepitaxy structure in electrical connection with the first connection endof the layer in the second set, wherein the epitaxy structure operatesas the source/drain structure.
 12. The method of claim 10, wherein theheight above the substrate is zero.
 13. The method of claim 10, whereinthe height above the surface of the substrate reaches up to asubstrate-facing surface of a bottom-most layer in the second set oflayers.
 14. The method of claim 10, wherein the first layer and thesecond set of layers together form a stack of layers, furthercomprising: recessing the stack of layers to form the first recess and asecond recess, wherein the second recess exposes a second connection endof the layer in the second set, the second connection end being on anopposite side from the connection end, wherein the first recess and thesecond recess each reaches into the substrate for at least the fractionof the total depth of the substrate.
 15. The method of claim 10, whereina second layer immediately adjacent to the first layer comprises thesecond sacrificial material.
 16. The method of claim 10, wherein asecond layer immediately adjacent to the first layer comprises thechannel material.
 17. The method of claim 10, wherein the set of layersof the channel material includes a plurality of layers.
 18. The methodof claim 10, wherein the first layer comprises a first sacrificialmaterial, wherein the first sacrificial material is etchable by aprocess at a first rate, wherein the second sacrificial material isetchable by the process at a second rate, and wherein the first rate isgreater than the second rate.
 19. A semiconductor fabrication systemcomprising a lithography component, the semiconductor fabrication systemwhen operated on a wafer to fabricate a semiconductor device performingoperations the comprising: depositing, over a surface of a substrate, afirst layer; depositing, over the first layer, a second set of layers ofa channel material; depositing a liner in a first recess; exposing fromthe liner a first connection end of a layer in the second set; causingthe first recess to be occupied with an insulator material up to aheight above the surface of the substrate; and enabling the firstconnection end of the layer in the second set to form an electricalconnection with a source/drain structure, wherein a remaining portion ofthe insulator below the height and a remaining portion of the liner inthe first recess electrically isolates the source/drain structure fromthe substrate and increases impedance in a path of a substrate currentfrom the source/drain structure to the substrate.
 20. The semiconductorfabrication system of claim 19, further comprising: growing an epitaxystructure in electrical connection with the first connection end of thelayer in the second set, wherein the epitaxy structure operates as thesource/drain structure.